Ultra-low density conductive material! Nickel/copper coated hollow PAN particles.
Incredibly lightweight! Ultra-low density conductive material with hollow PAN particles as the core.
This is a microparticle coated with copper and nickel on the surface of hollow PAN particles, based on our unique microparticle processing technology. It can be primarily used in electromagnetic wave shielding films, conductive adhesives, conductive pastes, and more. <Features> - Low-density conductive particles with excellent conductivity - Sharp particle size distribution compared to metal particles - Very low sedimentation rate of particles when mixed with solvent binders Additionally, we can provide customization based on your requests, such as particle size, metal coating amount, and surface treatment agents. *For more details, please contact us or download and view the catalog.
- 企業： NISSEI CORPORATION
- 価格：Other
